Which one of the following technologies in IC packaging provides the greater packing densities in circuit board assembly: (A) pin-in-hole technology, (B) surface-mount technology, or (C) through-hole technology

B) Surface mount technology provides the greater density in circuit board.

Explanation:

In the layout design of an printed circuit board (PCB) is required to consider:

1. The size of the elements.

2. The wire width (max, min).

3. The clearance between the wires.

Taking this into account, the benefits of using Surface Mount technology are: - the devices are smaller

-can be soldered only on one layer (the other technologies needs 2 layers, one for the device and one for the pin)

- the parasitic capacitance and resistance are smaller.